
Heat Sink Compound - Thermal Conductivity 0.437 W/mk | Non-curing, High Dielectric Strength 7.2 Kv/mm, Efficient Heat Dissipation
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Product Overview
Key Features
Salient Features:
High thermal conductivity (0.437 w/mk)
Non curing compound
Dissipates heat from the device
Increase the over all efficiency of the device
High dielectric strength (7.2 kv/mm)
Company Details
Anabond Limited is listed in Trade India's list of verified sellers offering supreme quality of Heat Sink Compound, etc. Buy Heating Elements in bulk from us for the best quality products and service.
Business Type
Exporter, Manufacturer, Supplier
Employee Count
507
Establishment
1979
Working Days
To
GST NO
33AACCA4158Q4ZC
Certification
ISO 9001
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Seller Details
GST - 33AACCA4158Q4ZC
Chennai, Tamil Nadu
DGM-BD
Mr. Biju Sadasivam Santha
Address
No. 36, Type II, Dr. V.S.I. Estate, Chennai, Tamil Nadu, 600041, India
heat sink compound in Chennai
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