IC & Sensor Packaging Expo 2027 Tokyo
Wed, February 17, 2027 - Fri, February 19, 2027
10:00 AM - 05:00 PM
Tokyo Big Sight - Tokyo International Exhibition Center, Tokyo, Japan
Trade Show
Upcoming
About Exhibition
IC & Sensor Packaging Expo 2027 Tokyo will be held from 17th - 19th February 2027 at Tokyo Big Sight in Tokyo, Japan. This is a trade fair focusing on the final assembly and packaging of integrated circuits (ICs). It brings together companies from all over the world to showcase their latest products and technologies. It features a technical conference with presentations by industry experts on the latest trends and challenges in IC packaging. It provides a platform for them to stay informed about the latest technologies and trends, network with industry peers, and explore new business opportunities.
Exhibitor Product Profile
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Visitor Profile
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Business Visitors are Semiconductor Manufacturers, Assembly Manufacturers/SATS, Sensor Manufacturers, Set Manufacturers (in high-density SMT), MEMS Devices/LED Manufacturers, Automotive Electronics Manufacturers and much more.
Past Editions
2020-01-15 - 2020-01-17
2021-01-20 - 2021-01-22
2022-01-19 - 2022-01-21
2023-01-25 - 2023-01-27
2024-01-24 - 2024-01-26
2025-01-22 - 2025-01-24
2026-01-21 - 2026-01-23
About Venue
Organized By
RX JAPAN LTD.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku,
Venue Map & Directions
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