Collating Machine In Tianjin

Product DescriptionAutomatic Sheet Collating Machine The machine is designed for automatically picking, collating and bonding the sheets (2 printed sheets+1 middle core sheet or only 2 printed sheets), which can greatly improve the plastic card production productivity. Key Features: It applies mature ultrasonic bondin

MOQ1 Unit/Units

Operating TypeSemi Automatic

ColorBlue

Usage/ApplicationsMaking Coil Nai

Product DescriptionOur offered QZD-68 Automatic Conical Paper Cone Collating Machine make V-shaped opening cut, opening polishing, line pressing,head reflecting, napping, counting and collating to the semi-finished products.\015\012\015\012The speed of this machine can be adjusted freely. The reliable overload protect

MOQ1 Unit/Units

Product TypeOther, Nail Collated Machine

Power SourceElectricity

Operating TypeAutomatic

MOQ1 set

FOB PortShanghai

Supply Ability100000 Per Month

Delivery Time15 Days

MOQ1 Set/Sets

MaterialSteel

MOQ1 Set/Sets

ComputerizedYes

Automatic GradeAutomatic

Control SystemPLC Control

Product DescriptionManual Sheet Bonding Machine General Description Controlled by solid relay, the machine applies the imported temperature control system for temperature controlling, and time relay is used to control bonding time. It can bond the materials as belowPVC, ABS, PET, etc; Note: different materials have di

Product DescriptionContact less Card Antenna Embedding Machine is designed for embedding or implanting the copper wire onto INLAY middle sheets as per the designed track with advanced ultrasonic technology. It is well known as the most reliable and economical machines in INLAY sheet production. The special worktable d

Product DescriptionWe are manufacturing, exporting, importing and supplying huge range of Contactless IC Module Picking-Placing Machines in Tianjin, China. Contactless IC Module Picking-Placing Machine is designed for precisely placing the single contactless IC chip onto chip fixing holes in the INLAY sheet. In order

Product DescriptionContactless Card Chip Bonding Machine YCB-15 is designed for bonding or welding the contactless card antennas and chips together in an automatic and speedy way. In order to ensure its reliability, the key components such as PLC, touch screen and servo system from Mitsubishi are applied inside. The l

MOQ1 , Unit/Units

Product TypeOther, Crimped Wire Mesh Machine

Power SourceElectricity

Weight (kg)1.5 Tonne