Wafers In Pusan
(6 products)
Nonelastic Solid Metal Seat Brm Lug (Wafer)
Design StandardJis, Ansi
Design Pressure5/20
Design Temperature-40~+600
Size80A~1000A
FluidSteam, Oil
BodyDuctile Iron
PLC Splitter Wafer 1xN, 2xN
MaterialSilica Glass
Wavelength Range1260-1650nm
PDLLow
ILLow
UniformityHigh
PackagingWafer
PLC Splitter Wafer - Planar Waveguide Material, 8 Inch Wafer, 1x8/1x16/1x32 Types | Low Insertion Loss, Low PDL, Wide Wavelength Range
Size8 inch wafer
MaterialPlanar waveguide
WavelengthWide range
Insertion LossLow
PDLLow
UniformityLow
OPUS3 Prober handling SEMI standard wafers
MOQ1 Set/Sets
Operating Temperature15AdegC to 35AdegC
Mounting TypeFloor Standing
Efficiency>95%
Humidity %20% - 80% (Non-Condensing)
Connector TypeSMEMA, USB, RS232
FeatureProgrammable, High Precision, Automated Handler, SEMI-Compliant
Wafer Chip Semiconductor - Silicon 10mm Diameter, 0.5mm Thickness | Low Power, Durable, Scalable, ±1% Tolerance
MaterialSilicon
Diameter10mm
Thickness0.5mm
Resistance10kΩ
Tolerance±1%
Operating temperature-40°C to +125°C
Wafer Inspection (WIS-1000) - 1500x1000x2000 mm, Line Scan CCD Camera, Hybrid Illumination | Surface Defect 2D, Bump 3D Inspection, Golden Die, Advanced D2D Algorithm
Inspection TypeSurface, Bump
Camera TypeLine Scan CCD
IlluminationHybrid
AlgorithmGolden Die, D2D
ThroughputVariable
Dimensions1500x1000x2000 mm (Approx)
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