Two Component Silicone Additive Potting Encapsulants

We are engaged in exporting and supplying excellent quality Two Component Silicone Additive Potting Encapsulants to our valuable clients. LEED-INK silicone encapsulant is a two-components room curing silicone thermal conductivity encapsulant. It is designed for long-term protection of precision electronic equipment and components in electronic industry. It is especially suitable for the sealing of electronic circuit boards and components in bad environment(such as moisture, shock and corrosive place, etc.) and the heat dissipation of high power components.
Benefits
1. High thermal conductivity, high and low temperature resistance(-40a -250a )
2. Rapid curing time, and the curing time is adjustable
3. Good adhesivity with materials such as metal, plastics,etc.
Typical Properties
Mixing Ratio: 1:1
Room Temperature Operable Time (h) : i 8h / i 4h
Room Temperature CuringTime (h) : 24
Heating Curing Time (h) : 100a /15min
Density (g/cm 3 ): 2.54 / 1.50
Hardness (shore A): 60 / 42
Operating Temperature (a ): -40a -250a
Thermal Conductivity (W/m.K) :2.60 / 0.80
Volume Resistance (ICA.cm) : 10 14
Applications
The silicone encapsulant is applied to the sealing and heat dissipation of the electronic circuit board and components, to achieve insulation, moisture and shock proof.
Package
The general package is 1KG/Plastic jar, 5KGS/Plastic bucket, and 25KGS/Plastic bucket.