Automatic Solar Cell Laser Scribing Cutting Machine

We are Making and Supplying Solar Cell Laser Scribing Cutting Machine in Jiangsu, Jiangsu Sheng, China. Details as given below:-

Laser power: 10W 20W 30W 50W Fiber Laser
laser solar silicone wafer cutting machine is suitable for cutting,scribing of solar PV industry,just like mono crystalline silicon,poly crystalline silicon solar cell,amorphous ribbon silicon and silicon wafers.

KCS-20FA automatic laser solar silicone wafer cutting machine for silicon solar cell scribing processing, 156 * 156mm size solar cell divide into 2/3/4/5 aliquots.
The equipment has automatic working function, including automatic loading-- automatic identification positioning- automatic scribing-automatic broken-automatic sorting-automatic unloading-dust collection and dust removal.

Details of laser solar silicone wafer cutting machine

Model
GSC-10F |GSC-20F
Laser wavelength
1064nm
Laser power
10W |20W 30W 50W
Scribing/cutting width
30I m
Scribing /cutting speed
0-300mm/s
Scribing/cutting accuracy
A 10I m
Working area
350x350mm or 200mm*200mm (option)
Temperature control precision
0.5A C
Working power
380V(220V)/50Hz/3kvA or 110V/60Hz
Working table
negative pressure absorbing and dust elimination
Cooling method
forced air cooling