Procirc 9702 Hb Electroless Copper

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Product Specifications

Soldermask	Other, Compatible with standard soldermask processes
Test	Other, Qualified by tape test and solder float test
Flame Resistance Level	Dependent on board material (e.g., UL94V-0)
Board Type	Other, Rigid and flex PCB compatible
Insulation Resistance	Maintains base materials insulation resistance
Impedance	Does not impact controlled impedance
Hole Size	Capable of plating through microvia to large holes
Voltage Endurance	Supports high voltage endurance as per board spec
Product Type	Electroless Copper Solution
Base Material	Other, FR-4, CEM, polyimide, and others
Surface Finish	Other, Supports ENIG, HAL, OSP, and other finishes
Copper Thickness	Deposition ranges from 0.5 to 7 microns
Board Thickness	Applicable for various PCB thicknesses
Color	Other, Colorless to pale yellow liquid
Panel Size	Suitable for standard PCB panel sizes
Electrical Components	Not applicable (used for metallization)
Number Of Layers	Other, Suitable for single, double, and multilayer PCBs
Payment Terms	Cash in Advance (CID)
Supply Ability	1000 Per Month
Delivery Time	2-5 Days
Main Domestic Market	All India