Multilayer Printed Circuit Board - Fr-4, 1 To 28 Layers, Green Color, 0.5 To 7 Oz Copper Thickness, 0.2 Mm Min. Hole Size, Surface Finishing Options Including Enig And Hasl - Vacuum Packed For Enhanced Protection

We are offering our customers a wide range of Multilayer Printed Circuit Board, which are available following Specifications :-
Base Material: FR-4
Copper Thickness: 0.5oZ to 7oZ
Min. Hole Size: 0.2MM
Min. Line Width: 0.1MM
Min. Line Spacing: 0.1mm
Color: Green
Model Number: LTXXX
Board Thickness: 1.6MM
Surface Finishing: ENIG, gold finger, HASL, OSP, immersion tin, immersion silver
Packaging Detail: Vacuum packing
Inner packing: Vacuum Packing/Plastic bag
Outer Packing: Carton

Specifications
a), Layer: 1 to 28 layers
b), Material type: FR-4, CEM-1, CEM-3, High TG, FR-4 Halogen Free, Rogers
c), Board thickness: 0.15mm to 7.0mm
d), copper thickness: 0.5 OZ to 7.0 OZ
e), Size:
Max Board Size: 580MM*900MM
Min. Drilled Hole Size: 0.2MM
Min. Line Width: 0.1MM
Min Line Spacing: 0.1MM
f), Surface finishing: Hot Air Leveling, ENIG, Gold Plating, OSP, immersion tin, immersion silver, HASL + Gold finger
g) Solder mask color: green, blue, red, white, black
h) Tolerance
Shape tolerance: A 0.13
Hole Tolerance: PTH: A 0.076 NPTH: A 0.05