Multi Crystal Texturing System

We are engaged in offering excellent quality Multi Crystal Texturing System to our valuable clients.

Process Steps:-
a cTexturing (HF/HNO3)
a cDI rinse
a cPorous silicon removal (ambient KOH)
a cDI rinse
a cNative oxide/metal removal (HF/HCL)
a cDI rinse
a cDrying (heated DI slow pull and air knife)

Advanced Process Options:-
a cAdditional process baths available for further texturing
a cHave options for: HF/HNO3 texturing, KOH/IPA, or NaOH
a cTexturing bath must end with a SC-1, PV-160 bath (ECN)
a cHydrophilic surface is required for phosphorus doping

Key Features:-
a cHigh throughput with multiple robots, 1500 to 3000 wafers per hour
a cAutomated staging with 6 cassette input and output
a cLow cost of ownership; extended bath life, reuse of rinsing water
a cInput and output scales for wafer thickness metrics plus supporting software
a cMinimal wafer breakage (>1 in 500)
a cMinimal downtime for bath replacement, (<1 hour bath change)
a cMonitoring bath metrics such as pH and temperature, plus concentration as an option
a cProcess support provided, optimized texturing and PSG removal process
a cSafety is designed and built in; HF monitors, fire suppression, and SEMI safety compliant
a cSoftware is SECS /GEM compliant
a cSystem is SEMI S2 compliant

Process Control:-
a cAccess control
a cMultiple levels of functional security.
a cData logging
a cDetail data is logged in individual daily logs for operator tool interactions, all events, alarms, and warnings.
a cLot tracking log files