
Laser Scriber Cell Cutting
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Product Specifications
| Cutting Kerf | <100µm |
| Cutting Speed | Variable |
| Dimensions | 1500x800x1200mm |
| Features | Precise cutting, Smooth edges, Easy install, Efficient process, Standard design, High precision |
| Laser Type | Diode laser |
| Material Compatibility | Silicon, Germanium |
| Power Consumption | 1.5kW |
| Safety Compliance | CE |
| Usage | Solar cell scribing and cutting of Silicon, Germanium, and Gallium Arsenide semiconductor materials |
| Weight | 500kg |
| Payment Terms | Cash Against Delivery (CAD), Cheque |
| Sample Available | Yes |
| Sample Policy | Contact us for information regarding our sample policy |
| Main Export Market(s) | Asia |
| Main Domestic Market | All India |
Product Overview
Key Features
Scribing for mono-crystalline silicon, poly-crystalline silicon, amorphous-crystalline silicon, solar cell, wafer in solar industry. Silicon, germanium, gallium arsenide semiconductor materials scribing and cutting.
Standard Design:
Adopts international standard module structure design; reasonable structure, easy and convenient to install and maintenance.
Nice Scribing Result:
Diode side pump laser source, good laser beam quality, more narrow cutting kerfs on the solar cell and more smooth edge.
Company Details
Business Type
Service Provider, Supplier, Trading Company
Employee Count
25
Establishment
2012
Working Days
To
GST NO
07AACCI8254M1Z5
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Seller Details
GST - 07AACCI8254M1Z5
New Delhi, Delhi
managing director
Mr. Inderjeet Singh
Address
Plot No.l-53, Lajpat Nagar-II, New Delhi, Delhi, 110024, India
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