Copper Module Plate

We are one of the leading fabricator and exporter of Copper Module Plate. These plates must have the supreme heat conductivity and deformation resist capability due to it will withstand relentless impact of high temperature, pressure and strong friction during the production of steel bloom. It also shall have the better strength under high temperature, surface fitness as well as friction-resist capacity. CuCrZr/CuAg is better than other copper materials in respect of high-temperature strength, thermal and electrical conductivity. Plating is applied to prevent copper mould plate from any starry cracks and penetration of copper into steel bloom, also to improve lubrification and abrasion-resist ability. Plating material uses CO-NI alloys, among of which Co ions are easy to separate out and form a silicon oxidized ceramic layer by which improved anti-friction characteristics of the plating and then subsequently increased the steel output. Working life of Co-Ni and Ni-Co plating was extended by 30% longer than that of NiFe plating.