Aluminum Paste - Ultra-low Softening Point, Eco-friendly Binder | Oxidation-proof, Enhanced Conductivity, Adhesive Sintering Performance

We are instrumental in providing to our valuable customers excellent quality Aluminum Paste which is available with following Features:-
a. Glass binder in the aluminum filling contains no lead, the softening point is quite low, and it is friendly to the environment.
b. Special technique protects the aluminum powder from being oxidized in the grinding to prevent the aluminum filling from aluminum foam, aluminum globule and settling in the baking to guarantee the conductivity of the aluminum filling.
c. It improves the aluminum filling sintering performance that the sintered aluminum film is more adhesive to the silicon chip to form the favorable ohmic contact and strengthen the photoelectric conversion rate of the cell.
d. It strengthens the printing adaptivity and improves the net crossing performance of the aluminum filling.
e. The surface curvature of the sintered aluminum filling is small and it is outstanding in bending resistance. The curvature of the 5-inch silicon wafer whose thickness<200I m is less than 1.5mm.

Clients can avail this Aluminum Paste at industry leading prices from us.