4 Layer Al Basement Pcb - 1.6 Mm Thickness, 1.2 Mm Copper Thickness, 250 × 540 Mm Panel Size | High Performance Multi-layer Design

4layer Fr4+al Basement Pcb - Aluminum Base Material, 250 × 540 mm Panel Size, 1.6 mm Board Thickness, 1.2 mm Copper Thickness | Precision Engineering Design

8 Layer HDI PCB with Half Hole Plated - Aluminum, 1.6 mm Board Thickness, 1.2 Meter Copper Thickness, Panel Size 250 × 540 mm | High-Density Interconnect Technology

2Layer Thick Gold Pcb Base Material: Alumunium

Single Layer Al Basement PCB That Can Be Bent - 1.6 mm Thickness, 1.2 mm Copper, 250 × 540 mm Panel Size | Flexible Design for Diverse Applications

Double Layer Ceramic PCB - 1.6 mm Thickness, 250 × 540 mm Panel Size | Enhanced Thermal Clad Efficiency, Reduced Interconnects, Compact Design

10 Layer Hdi Pcb - Aluminum, 250 × 540 mm Panel Size, 1.6 mm Thickness, 1.2 mm Copper | Higher Packing Densities, Longer Operating Times, Lightweight

Single Layer Fpc, Al+pi Basement - 1.6mm Board Thickness, 250x540mm Size | Aluminum Base, 1.2mm Copper Thickness for Enhanced Performance

2 Layer Enepig PCB - 1.6 mm Thickness, 1.2 mm Copper, 250 x 540 mm Panel Size | Dual Layer, High Precision Circuit Board Solution

Double Layer Enepig Pcb - Aluminum Base Material, 1.6 mm Board Thickness, 250 x 540 mm Panel Size, 1.2 mm Copper Thickness | Enhanced Thermal Conductivity, Increased Power Density, Reduced Interconnects