Specifications of Glass Cutting System : Wavelength10.6m Average Power100W/250W Glass substrate size 650700mm 10001000mm 30003000mm Applicable Thickness0.2-5mm Max Speed350mm/s Accuracy30m Planeness 30m Applications Thin Film Solar Cell Substrate FPD liquid crystal plate ITO Coated Glass Tempered Gl

UV Laser Wafer Scribing Systems is a high precision laser system developed by Delphi Laser, specifically to support LED chip manufacturing. Substrates, such as Sapphire, Copper, Silicon, Cobalt as well as Alloy, can be scribed with high precision. This system has a very good quality and can achieve

We are well established firm offering Die Board Laser Cutting Machine including Glass Cutting System, UV Laser Wafer Scribing System that are highly demanded among the clients.

Suzhou Delphi Laser Co., Ltd. - Exporter of Die Board Laser Cutting Machine, Glass Cutting System, Infrared Laser from Suzhou, Jiangsu, China.

Suzhou Delphi Laser Co., Ltd. - Die Board Laser Cutting Machine (2)

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Glass Cutting System

UV Laser Wafer Scribing System