Semi Automatic Wafer Bump

With the continuous support and sincere efforts put by our experienced professionals, we have been able to provide the best quality range of Semi Automatic Wafer Bump to the clients in Pune , Maharashtra , India. We provide these products at market leading price.
Product Features:
Shear testing using Nordson DAGE's patented air bearing frictionless intelligent load cell system
Fully automatic wafer handling via customer's third party robot handler (SMIF/FOUP) equipment
Wafer handler and bondtester can operate in isolated environment with minimum operator interaction
Joystick manipulation of 100% of wafer surface under test head without repositioning of wafer
Semi-automatic test routines using 2 reference points (no camera system required) per wafer enable bondtesting to the entire wafer surface without repositioning
460mm x 300mm XY stage with robot compatible chuck. Pneumatically operated pins allow wafer exchange using a robot handler
360 degree load tool rotation - optional
Automatic calibration and linearity checks
Integrated analysis including statistics and SPC functions
ODBC compliant