Condition : Packed\015\012Quality : Good\015\012Void : <15%\015\012Void : >25%\015\012paste_dwq : 401_3.jpg\015\012paste_dwq : 401_4.jpg\015\012Ideal For : Solderng Wire

Humidity : 50  10% RH Instrument : Oxygen ion chromatography Calibration : 0.5, 1, 3, 5 ppm Result : F = N.D., Cl = N.D., Br = N.D. Total : N.D

Sn/0.3Ag/0.7Cu Printer : DEK ELAi Printing Speed : 60 mm/s Atmosphere : 25, 50%HR Stencil Thickness : 130 Microns Stencil Separation Speed : 40N Stencil Material : Stainless Steel Stencil Separation Speed : 0.3 mm/s Deposition Test Pattern : QFP Pad (Fine Pitch

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THE ENGINEER STORE - Exporter of Solder Paste, Dyfenco Hi-q Sn63-AM218FT Solder Paste, Dyfenco Hi-Q Solder Paste from Bengaluru, Karnataka, India.

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Dyfenco Hi-Q Solder Paste

Dyfenco Hi-q Sn63-AM218FT Solder Paste

Dyfenco HI-Q SAC0307-PN436T-T4 Lead Free Solder Paste