Embedded Board

MOQ1 Piece/Pieces

Weight1.1 Kilograms (kg)

CPUIntelA(r) 12th/13th Gen Corea,,C/ Processors CPU in LGA1700 package

ChipsetIntelA(r) Q670E

MemorySupport up to 64GB DDR5 4800 on two SO-DIMM socket Gigabyte (GB)

OSIntelA(r) 12th/13th Gen Corea,,C/ Processors CPU in LGA1700 package

MOQ5 Unit/Units

UseEducation, Corporate, Training ,Information Sharing Etc

Size110 Inch

FeaturesHigh Quality, AI Features

Power TypeElectric

StyleModern

ShapeRectangular

MOQ1 Number

Payment Terms], [

Main Domestic Market[, ]

MOQ1 Unit/Units, Unit/Units

Connector TypeScrew terminal / JST / pin header (as specified)

Operating Temperaturea^'20 AdegC to +70 AdegC Celsius (oC)

ApplicationIoT devices, embedded systems, sensors, industrial control, automation

FeaturesHigh design

Rated Current0.5 A aEUR" 3 A Ampere (amp)

Product TypePCB

Programming LanguagesC/C++

OS SupportRTOS, Linux

MicrocontrollersARM, AVR

Development ToolsIDE, Debugger

TestingUnit, Integration

ComplianceISO 26262

MOQ2 Unit/Units

CPU4x Arm Cortexa,,C/-A53

Memory4GB LPDDR4 (32-bit) Gigabyte (GB)

OSTorizon, Embedded Linux

MCU Options8051, PIC, ARM

Clock Frequency4-60 MHz

Flash Memory32K-512K

RAM1K-64K

InterfacesUART, SPI, I2C, USB

Display16x2 LCD

ProcessorVIA EPIA-N2700

Dimensions170x170mm

MemoryDDR3

InterfacesUSB, Ethernet, SATA

Operating systemLinux

Power Consumption5W

Dimensions100x50 mm

Weight50g

ProcessorARM Cortex-M3

Memory64MB

Operating voltage5V

Operating temperature-20°C to +70°C

Design MethodologySchematic Capture

PCB MaterialFR4

Number Of Layers4-8

ComplianceRoHS

MicroprocessorCustomizable

UsageCustom embedded system development for diverse applications like industrial automation, telecommunications, and medical devices.

ProcessorEmbedded

MemoryVariable

Operating SystemCustomizable

InterfacesMultiple

Dimensions10x7 cm

UsageIndustrial automation, data acquisition, and embedded systems applications