Thermally Conductive Silicone Rubber Pads (Xk-r10)
Product Overview
Key Features
Introduction
XK-R Series silicone rubber thermal gap filler is a kind of silicon rubber-based gap filling material which is highly compressed with high heat-conducting filling materials. The coefficient of heat conductivity can reach 1.0~ 3.0 W/m.K. This kind of materials is aiming at offering super heat-conducting property and maintains the cost efficiency of customers as well.
Features
Un-reinforced construction for additional compliance
Medium compliancy and conform-ability
High thermal performance, cost-effective solution
Easy to USE ( 0.1~0.5mm )
Applications
Consumer electronics.
Automotive Systems.
Telecommunications.
Aerospace.
Military.
Medical devices.
Industrial controls.
Company Details
Focusing on a customer-centric approach, Shenzhen Goldlink Tongda Electronics Co., Ltd. has a pan-India presence and caters to a huge consumer base throughout the country. Buy Industrial Supplies-General in bulk from Shenzhen Goldlink Tongda Electronics Co., Ltd. at Trade India quality-assured products.
Business Type
Exporter, Manufacturer, Supplier
Establishment
1998
Seller Details
Shenzhen Goldlink Tongda Electronics Co., Ltd.
Name
Mr. Lynn Gui
AddressView on Map
Room 619, Huafeng Xin'an Building, 45 Block Bao'an Dist., Shenzhen, Guangdong, 518101, China
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