X-ray Inspection System For Smt/semicon/solar/conn/led High-definition Darkness Range: 2
Delivery Time
: 25 Days
Supply Ability
: 10 Per Day
Sample Available
: Yes
Product Overview
Key Features
X-Ray inspection system X7800 X ray x-ray inspection system machine equipment X 6600 for SMT SMD BGA LED PCB semiconductor battery casting ceramic connectors
High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire
90KV 3um (130 KV Optional)closed X-ray tube,long life time,maintenance in free
2.3 mllion high resolution digital flat panel detector
6 axis linkage system.
60 degrees observation
Platform 360A rotation
Color lmage Navigation & Mapping Navigation
Full Automatic BGA Detecting Procedures
Simple mouse click programming ,automatically detects the components of each BGA without the need for operator intervention
Automatic IC Semiconductor detect, accurately check the bridge, welding, cold welding and void ratio of BGA.
Automatic IC Semiconductor detect ,repeatable detect results in order to process control
Detect results will be displayed on the screen and can be output to Excel to facilitate review and archiving
Mapping Mosaic Function.(optional )
Scalable 3D module(industrial CT) (optional)
Programmable Detection.(optional )
Youtube: 7600 X ray Equipment video-how to detect
Application:
1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.
2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.
3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.
4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.
5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.
6) Inner rupture or hollow inspection in plastic or metal.
7) Battery stacking uniformity, electrode welding inspection.
8) Seed, biological material inspection etc.
Applications:
LED, SMT, BGA, CSP, Flip Chip Inspection
Semiconductor, Packing components
Battery Industry
Electronic components, Auto parts, Photovoltaic Industry
Aluminum Die Casting, Moulding Plastic
Ceramics, Other special Industries
Related Article: x ray knowledge
Non-destructive testing DR X-Ray imaging
X-Ray Inspection System For SMT/Semicon/Solar/Conn/Led High-Definition Specification
Material
AL
Condition
New
Technology
High Frequency
Portable
Yes
Light Source
Yes
Pressure Range
0.4mpa
Operating Temperature
10-42 Celsius (oC)
Humidity %
30
Sensors Specification
2
Indicator Specification
2
Darkness Range
2
Speed Range
5S/pc
Ray Frequency Range
1 Hertz (HZ)
Exposure Time Range (in Sec)
1 Years
Focus
1
Image System
yes
Usage
X ray x-ray inspection system machine equipment X 6600 for SMT SMD BGA LED PCB semiconductor battery casting ceramic connectors
Power Source
Electric
Power Consumption
12 Kilowatt (kW)
Working Voltage
12
Dimension(L*W*H)
5200*6588*2525mm Millimeter (mm)
Weight
520 Kilograms (kg)
Main Domestic Market
All India
Certifications
CE, FDA, EU
FOB Port
Shenzhen
Packaging Details
wooden case
Sample Policy
Sample costs shipping and taxes has to be paid by the buyer
Company Details
Business Type
Exporter, Manufacturer, Distributor
Employee Count
100
Establishment
2005
Working Days
Monday To Saturday
Payment Mode
Telegraphic Transfer (T/T)
Seller Details
Shenzhen Zhuomao Technology Co., Ltd
sales manager
Ms Joy Rong
AddressView on Map
building 10, Huaide cuihai industrial park Shenzhen, Guangdong, China
Report incorrect details
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