Microtech Corporation

Pune, Maharashtra, India|GST 27AAIPU7991C1Z5|

Microtech Corporation - Products & Services

GST

27AAIPU7991C1Z5

Rating

5

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Proprietor

Mr. Sanjay Upasani

Address

Office No. 10, "D" Wing, 6th Floor, K.K Market, Dhankawadi, Pune, Maharashtra, 411043, India

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BOND Dilutor - Colorless Liquid, Fast-Drying Non-Toxic Cleaning Agent | Excellent Solvent Power, Miscible in Water, Zero Residue Drying

BOND Dilutor - Colorless Liquid, Fast-Drying Non-Toxic Cleaning Agent | Excellent Solvent Power, Miscible in Water, Zero Residue Drying

Bond No-Clean Leaded Solder Wire - 60/40 Tin/Lead, 16 SWG | High Quality Soldering, Transparent Non-Corrosive Residue, Low Spattering, Passed Copper Mirror Test

Bond No-Clean Leaded Solder Wire - 60/40 Tin/Lead, 16 SWG | High Quality Soldering, Transparent Non-Corrosive Residue, Low Spattering, Passed Copper Mirror Test

Solder Stick Lf9 And Lf3 Rohs (Lead Free) Gender: Unisex

Solder Stick Lf9 And Lf3 Rohs (Lead Free) Gender: Unisex

Soldering Flux N C 850L - Liquid, Pale Yellow to Brown, Specific Gravity 0.805, 4.50% Solid Content | Ideal for PTH Multilayer PCB, Low Residue, High Reliability

Soldering Flux N C 850L - Liquid, Pale Yellow to Brown, Specific Gravity 0.805, 4.50% Solid Content | Ideal for PTH Multilayer PCB, Low Residue, High Reliability

Bond 60-40 Solder Wire 22 SWG - Tin/Lead 60/40, 0.71mm Diameter, Grey | Rapid Wetting, Good Spreadability, Heat Resistance, 2% Flux

Bond 60-40 Solder Wire 22 SWG - Tin/Lead 60/40, 0.71mm Diameter, Grey | Rapid Wetting, Good Spreadability, Heat Resistance, 2% Flux

Bond 50/50 Solder Wire No Clean 22 Swg Diameter: 7 Centimeter (Cm)

Bond 50/50 Solder Wire No Clean 22 Swg Diameter: 7 Centimeter (Cm)

BOND 60-40 Leaded Solder Wire - 20 SWG, Tin/Lead Material, Grey Color, 0.71mm Diameter, No-Clean Flux, Highly Transparent Residue, Non-Corrosive, Low Spattering

BOND 60-40 Leaded Solder Wire - 20 SWG, Tin/Lead Material, Grey Color, 0.71mm Diameter, No-Clean Flux, Highly Transparent Residue, Non-Corrosive, Low Spattering

BOND No-Clean Solder Wire - Leaded 60/40 Composition, Gauge 18 SWG | High-Quality Transparent Residue, Low Spattering, Non-Corrosive

BOND No-Clean Solder Wire - Leaded 60/40 Composition, Gauge 18 SWG | High-Quality Transparent Residue, Low Spattering, Non-Corrosive

Bond 63-37 Tin-Lead Solder Wire - Diameter: 1.22 Millimeter (Mm)

Bond 63-37 Tin-Lead Solder Wire - Diameter: 1.22 Millimeter (Mm)

Fine Quality Flux No Clean

Fine Quality Flux No Clean

Soldering Bond Flux Bond

Soldering Bond Flux Bond

Bond 60-40 Solder Wire 24 Swg Nc Flux Content: 2.50A A 0.25 For Rma & 0.90-1.50 For No Clean

Bond 60-40 Solder Wire 24 Swg Nc Flux Content: 2.50A A 0.25 For Rma & 0.90-1.50 For No Clean

Seller Details

Rating

5

Proprietor

Mr. Sanjay Upasani

Address

Office No. 10, "D" Wing, 6th Floor, K.K Market, Dhankawadi, Pune, Maharashtra, 411043, India

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