Thermal Pad in Korea South

The objective of thermal management programs in electronic packaging is the Efficient removal of heat from semiconductor junction to the ambient environment.\015\012\015\012Applications of our Thermal Pads :-\015\012. Transferring heat to the chassis or frame from PCB or substrate\015\012. High spee

We are offering our customers a wide range of Thermal Silicon Pad Materials, which are available in various sizes and specifications.\015\012- Thermally and chemically stable (temperature -40 \342\204\203 ~ 200 \342\204\203)\015\012- Excellent flexibility, adhesion, and thermal conductivity.\015\012