
Cu/al Bimetal Plate For Led Cob Substrate
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Product Specifications
| Material | Cu/Al Bimetal |
| Thickness | 0.2-3.0mm |
| Width | 600-1000mm |
| Tensile Strength | 130-220MPa |
| Elongation | 10-20% |
| Copper Ratio | 10-20% |
| Usage | LED COB substrate cooling |
| Features | Superior Cooling, High Efficiency, LED Encapsulation, Excellent Heat Transfer, Durable Material |
Product Overview
Key Features
Detail:-
Sizes: thickness 0.2-3.0mm
Width: 600-1000mm
Feature:
LED chips encapsulation directly on the copper surface, the heat directly conducted to the surface, and then out through the aluminum powder, which is the most ideal COB
encapsulation cooling substrate materials.
Technical data:
Composite rate: 100%
Tensile strength: 130-220MPa
Elongation: 10-20%
Copper thickness ratio: 10-20%
Company Details
Business Type
Exporter, Manufacturer, Supplier, Trading Company, Producer
Employee Count
85
Establishment
2013
Working Days
Monday To Sunday
Payment Mode
Telegraphic Transfer (T/T)
Certification
ISO9001-2000
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Seller Details
Zhengzhou, Henan
Mrs. Jennifer Sun
Address
Rm 1321, Zhengang Mansion, No. 11 Zhengshang Road, Zhengzhou, Henan, 450007, China
cob led in Zhengzhou
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