Fal-d1212sf Co2 Laser Die Board Cutting Machine

We research and produce this new generation of FAL-D1212SF CO2 Laser Die Board Cutting Machine for meeting the need of cutting thick templates, like wooden template, plastic board, density of fiberboard (MDF/HDF), plexiglass plate, etc. Laser die board cutting machine in FALC adapts double laser heads cutting technology and is widely used in MDF/HDF processing, plywood Plexiglass processingi printing and packaging industries.

Features:
1.High precision. Special mechanical and optical structure, imported linear guide and advanced CNC control system ensure high stability and repeatability during cutting process.
2.Good protection system. Special smoke exhaust system ensures long life of consumables and equipments.
3.Super low power consumption. Low running cost for low electrical, consumables consumption. No need any inactive gas in processing.
4.Easy to maintain. Owning to the modular concept, the realization of all functions are integrally designed and the equipment is very compact, thus greatly reduces the users maintenance times and degree of difficulty.

Technical Parameters of FAL-D1212SF CO2 Laser Die Board Cutting Machine:
Model: FAL-S1212SF
Working Area: 1200mm*1200mm
Working Speed: 0-0.5m/min
Cutting Width: 0.35-0.75mm adjustable, >0.75mm adjustable
Cutting Thickness: <23mm
Cutting Precision: <0.02mm
Repeating Position Precision:0.01mm
Laser Power: 300W (150W*2) CO2 laser tube
Laser Path: Semi-flying laser path
Format Support: PLT, EPS, BMP, DXF