Modeling Plotter

Modeling Plotter Engraving with your computer and sign-making /CAD softwareMaximum engraving areasME-500: 483X305mm(19X12")ME-650: 650X440mm(25.6X17.3")Long materials can be set along the front-back direction. Maximum material widths are 650mm(25.6") for the ME-500 and 750mm(29.5") for the ME-650.HP-GL *1 CompatibleMost of sign-making and CAD software programs for both PC and MAC support HP-GL.The ME-500/ME-650 can be driven by these programs.3D-EngravingSimultaneous 3-axis linear interpolation enables smooth and speedy 3D engraving.Wide variety of materialsThe ME-500/ME-650 can engrave on metals as well as plastics.Accurate engravingRigid construction ad servo control technologies of Mimaki accumulated through years of developing and manufacturing of drafting and cutting plotters allow the ME-500/ME-650 to engrave very accurately. ALL X, Y, and axes are servo motor driven for maximum with uneven thickness.Automatic material height sensing and constant depth engravingMaterial height sensor eliminates needs for manual adjustment of spindle height and ensures constant depth engraving on a material with uneven thickness.Test-drawing with penOptional pen can be attached to test-draw before actually engraving. (Optional pen holder is required to install this pen.)60mm Z-strokeSpindle can move up to 60mm(2.4") above table and allows materials of up to 50mm(2.0") to be set.Software controllable spindle height adjustmentSpindle height adjustment can be done through software as well as from the ME-500/ME-650's handy operation panel, which makes multi-pass engraving easy.Large memory bufferA computer can send jobs to the ME-5--/ME-650's one megabyte memory buffer without waiting for the ME-500/ME-650 to finish engraving.The computer therefore can be used for another fob while the ME-500/ME-650 are engraving.Also, data stored in the memory can be used to engrave the same job.Handy Operation PanelOperation panel is separated from the main body for ease of use.All electrical circuitry is contained in the main body and the handy operation panel.Chip removal attachment and AdaptorThe ME-500/ME-650 are equipped with a chip removal attachment and an adaptor to a vacuum pump.Typical vacuum pump*2 can be easily attached to the adaptor.Optional Vacuum Pump Controller turns on/off power to the vacuum pump so it will run only when engraving.*1 HP-GL is a trademark of Hewlett-Packard Co.*2 Vacuum pump is not included.Specifications Model ME-500 ME-650 X-YAxes Engraving Area 483 x 305mm(19.0 x 12.0") 650 x 440mm(25.6 x 17.3") Speed Engraving 0.5-50mm/sec (0.02-2.0"/sec) Moving 20-80mm/sec (0.8-3.1"/sec) Acceleration Engraving 0.05G Moving 0.3G Mechanical Resolution 0.5m Z-Axis Maximum Z stroke 60mm (2.4") Speed Engraving 0.5-10mm/sec (0.02-0.4"/sec) Moving 5-30mm/sec (0.2-1.2"/sec) Acceleration Engraving 0.05G Moving 0.3G Mechanical Resolution 0.25m Command Resolution 10, 25m Spindle Rotation 7000-14000rpm Spindle Diameter 6mm(0.24"), 3mm(0.11") optional Maximum Material Weight 20kg (44lbs) Command MGL-IIC3 (HP-GL*1 based) Receiver Buffer Size 1MB Interface RS-232C Flatness 0.2mm Distance Accuracy 0.1mm/300mm Perpendicularity 0.3mm/300mm Repetition Accuracy 0.05mm Origin Repetition Accuracy 0.2mm Power Requirement AC100, 120, 220, 240V Factory preset50/60Hz Power Consumption 350VA or less OperatingEnvironment Temperature 5-40C Humidity 35-75% (Rh) No condensation Dimensions (W x D x H) 785 x 730 x 510mm(30.9 x 28.7 x 20.1") 880 x 940 x 510mm(34.6 x 37.0 x 20.1") Weight 80kg (177lbs) 95kg (210lbs)