Slr Range Of Reflow Soldering Systems

SLR Range of reflow soldering systems are the state-of-the-art soldering systems for SMD and hybrid PCB assemblies. SMD Components are soldered on the PCB by the reflow process: a process where desired amount of solder paste is applied to the PCB pads; SMD is gluded/placed on the pads and then this assembly is heated to a temperature slightly higher then the melting point of solder. The solder paste heats, melts and reflows forming a strong metallurgical joint. Heat is transfered to the PCB and SMD by rediation from a heat source that faces the PCB side to be soldered. Heat transfer by radiation is goverend by three parameters; Temperature of heat source, distance between the source (heater) and the sink (PCB) and the duration of expouser (inversely proportional to chain speed) All three parameters are infinitly controlable in this range of machines.