Following are the Main Features of ZX-C1 BGA Rework Soldering Station :-
1. With three independent temperature zone control, upper and bottom main heater with hot air to heat, third zone with infrared to preheat;
2. Upper heater with 8 segment temperature up (down)+8 segment constant temperature control, can store 10 groups temperature curve; Upper, bottom heater and infrared start heating at the same time;
3. Three temperature zone with independent PID to control heating process, more stable and accurate;
4. Bottom heater and IR preheating zone with supporter to prevent PCB part deformation;
5. After remove and solder, using high-volume fan to cool the PCB board, prevent deformation of PCB board and ensure the effect of soldering;
6. Equipped with a variety size of hot-air nozzle, or made according to special requirements, free rotation of hot air nozzles;
7. Build-in vacuum pump, no need gas source.
SPECIFICATION
PCB Size ≤L350 ×W 250mm
PCB Thickness: 0.1~5mm
Temperature Control: K Thermocouple, Closed loop
PCB Positioning: Outer
Sub (Bottom) heater: Infrared 2400W
Main (Top) heater: Hot air 800W+800W
Power supply: Single phase 220V,50/60Hz,3.4KVA
Machine dimension: L530 ×W500×H520mm
Weight of machine: Approx.33kgs
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