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Bismaleimide / ABRON (BR 720 FR) is an bismaleimide based resin composition which is useful for the
manufacture of FR4 grade printed circuit boards which would meet the
UL-94 test of flammability. ABRON BR 720 FR can be used to prepare
laminates for the electronics industry by the standard techniques used
in the field. The resin, ABRON BR 720 FR, is dissolved in an solvent
and then used to impregnate fabric (glass, silica, etc) and then dried
at an elevated temperature to form a prepreg. The prepregs so obtained
may be laminated with copper foil under pressure and temperature. These
laminates can be used in fabrication of printed circuit boards having
improved properties (Low dielectric constant, improved toughness and
excellent thermal resistance).
SPECIFICATIONS OF ABRON BR720FR
| APPEARANCE |
YELLOW FINE POWDER |
| BULK DENSITY |
0.6 - 0.8 gm/cc |
| INHERENT VISCOSITY |
0.3 - 0.5 dl/gm |
SOLUBILITY
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SOLUBLE IN NMP/DMF/DMAc |
| CURE TEMPERATURE |
180°C |
| SERVICE TEMPERATURE |
250 - 300°C |
| SHELF LIFE |
12 - 18 MONTHS WHEN STORED IN CLOSED CONTAINERS |
| RESIN CURE TIME |
4
- 5 MIN AT 180°C |
| PRESS CYCLE TIME |
2
- 3 HRS AT 180°C |
| POST CURING |
12 - 16 HRS AT 230 - 250°C |
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